LGA4677 Slot Server CPU Direct-to-Chip Liquid Cooling Plate

The LGA4677 Data Center Direct-to-Chip Liquid Cooling Plate is a high-performance cooling solution designed specifically for Intel Xeon processors. The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This CPU vacuum-brazed microchannel liquid cooling plate features an advanced, precision microchannel design that significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation.

Additional information

Product Description:

Server Form Factor1U ServerCPU TDP400W
CPU Socket TypeLGA 4677Lifespan50,000 hours
Liquid Cooling Plate Dimensions118 × 78 × 19.1 mmLiquid Cooling1U Liquid Cooling
Weight420 gramsLiquid Cooler MaterialCopper base + copper fins
Fin thickness0.15 mmCooling TypeLiquid Cooling
Fin Spacing0.15 mmRoHS ComplianceCompliant

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.