LGA4677 Slot Server CPU Direct-to-Chip Liquid Cooling Plate

The LGA4677 Data Center Direct-to-Chip Liquid Cooling Plate is a high-performance cooling solution designed specifically for Intel Xeon processors. The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This CPU vacuum-brazed microchannel liquid cooling plate features an advanced, precision microchannel design that significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation.

Additional information

Product Description:

Server Form Factor 1U Server CPU TDP 400W
CPU Socket Type LGA 4677 Lifespan 50,000 hours
Liquid Cooling Plate Dimensions 118 × 78 × 19.1 mm Liquid Cooling 1U Liquid Cooling
Weight 420 grams Liquid Cooler Material Copper base + copper fins
Fin thickness 0.15 mm Cooling Type Liquid Cooling
Fin Spacing 0.15 mm RoHS Compliance Compliant

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.