Faced with the staggering thermal density generated by high-performance server CPUs and GPUs, traditional air cooling has reached its limits. Leveraging cutting-edge liquid cooling technology and exquisite metalworking craftsmanship, Xinda Technology has launched this all-copper, custom liquid cooling module, designed specifically for next-generation data centers, AI computing clusters, and high-end workstations. It helps critical equipment break through thermal constraints to achieve sustained, stable, and quiet peak performance. We offer professional engineering and customization services, providing one-on-one design tailored to your server board layout, chip power consumption, spatial dimensions, and interface specifications. We deliver a complete solution—from thermal simulation analysis to final product delivery—ensuring seamless integration and optimal thermal performance.
Key Product Highlights:
1. Crafted from High-Purity Copper: The entire module—including the cold plate, heat pipes, tubing, and connectors—is made of pure copper. Copper’s exceptional thermal conductivity ensures maximum heat transfer efficiency at every stage, from the chip to the coolant.
2. 8 Parallel Liquid Cooling Plates: Capable of providing precise, efficient, and localized cooling for up to 8 high-heat-density chips (such as CPUs) simultaneously, making it ideal for multi-card configurations and high-density server architectures.
3. Embedded Heat Pipe Technology: Each cold plate contains embedded heat pipes. These heat pipes instantly dissipate heat from the chip’s hotspots across the entire surface of the cold plate. Combined with convective heat transfer through the internal precision water channels, this achieves dual-mode, highly efficient cooling via “phase-change conduction + liquid-cooling convection,” completely eliminating localized overheating.
4. Integrated Design and Reliable Sealing: Using advanced brazing technology, the cold plate, pipes, and connecting components are seamlessly welded into a single, high-strength integrated module. The all-metal construction eliminates aging and compatibility issues, offers superior pressure resistance, and minimizes the risk of leaks, ensuring the cooling system’s absolute reliability and safety during long-term high-pressure operation.
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
