Core Technology

1. Copper Plate Embedded Microchannel Water-Cooling Plate (Top Left)

A high-precision copper-based microchannel water-cooling plate with an embedded structure; the chamber is precision-molded as a single unit, and the flow channel layout conforms to the chip’s heat-generating surface, ensuring uniform heat transfer without hot spots;
Its lightweight, ultra-thin design is ideal for embedded and compact cabinet installations. It is pressure-resistant, leak-proof, and withstands high- and low-temperature cycling, ensuring no coolant leakage during long-term operation. It is suitable for cooling AI computing CPUs/GPUs and server main chips.

2. Custom-Bent Coolant Tubing (Top Row 2 / Bottom Row 1)

Custom-bent liquid cooling connection tubing made of red copper or stainless steel, featuring seamless, one-piece bending with precise curvature to match the space within equipment cabinets;
Precision-engineered sealed interfaces that are pressure-resistant, age-resistant, and resistant to thermal shock; suitable for liquid cooling unit inlet/outlet lines and module series piping; ensures long-term leak-free and scale-free operation under high and low-temperature conditions; fully customizable tube diameters, bend angles, and fitting specifications for all scenarios.

3. High-Power Chip Red Copper Cold Plates (Top Row 3)

High-efficiency pure copper cold plate with multi-point fastening and positioning structure, ensuring seamless contact with heat-generating chips and extremely low thermal resistance;
Integrated sealed chamber with high-flow microcirculation channel design rapidly dissipates concentrated heat from IGBTs and high-power computing chips; features vibration resistance, anti-loosening design, and long-lasting sealing, suitable for all operating conditions in automotive, industrial control, and energy storage applications.

4. Liquid-Cooling Manifold (Top Right)

Multi-port balanced liquid-cooling manifold that precisely divides inlet and outlet flow, enabling simultaneous cooling of multiple modules;
Precision-machined from a single piece of aluminum alloy, featuring a compact design and easy installation, it allows for rapid setup of multi-channel parallel liquid-cooling loops and is widely used in energy storage packs, cabinet clusters, and multi-module array cooling.

5. Fin-Type Long-Bar Water-Cooled Heat Sink (Bottom Left 2)

Features a stacked fin structure for efficient heat exchange, an extra-large heat dissipation contact area, and extra-long liquid cooling channels;
Offers ultra-high thermal power density, suitable for cooling long, bar-shaped power devices, long IGBT modules, and energy storage inverters. Its cooling efficiency far exceeds that of traditional flat cold plates and is compatible with long cabinets and equipment with elongated layouts.

6. Perforated Positioning Sealed Liquid-Cooled Substrate (Bottom Right 2)

Standardized perforated positioning mounting substrate with uniformly distributed fluid channels for balanced heat dissipation across the entire surface;
Standardized hole positions compatible with industry-standard mounting specifications; the sealed structure provides redundant protection, featuring insulation, voltage resistance, shock resistance, and leak prevention; designed for mass production and standardized cooling of general-purpose computing modules, energy storage BMS, and electronic control motherboards.

7. Integrated Fully Enclosed Red Copper Liquid-Cooled Heat Sink (Bottom Right 1)

A fully enclosed liquid-cooled heat sink housing that provides comprehensive protection and heat dissipation across the entire chip surface;
Featuring a copper thermal base and a sealed, waterproof outer shell, it simultaneously ensures efficient heat dissipation, component protection, and EMC shielding. Designed specifically for automotive electronic control units, automotive BMS, and outdoor industrial control equipment, it operates reliably in harsh environments characterized by extreme temperatures, vibration, and humidity.