Liquid cooling plates are made of copper, which offers high thermal conductivity and can quickly dissipate the heat generated by server chips (such as GPUs and CPUs). Vacuum brazing technology is used to join the liquid cooling plates, ensuring that the liquid cooling systems in data centers or liquid-cooled servers are free from the risk of leaks. Xinda Technology also tests our liquid cooling components and systems using specialized testing equipment, such as mass spectrometers and ultrasonic scanning microscopes, to ensure the high quality of our products. Xinda Technology is a manufacturer of liquid-cooled servers and data center liquid cooling components and systems, possessing advanced liquid cooling technology. If you are looking for liquid cooling system components or advanced data center liquid cooling solutions, please contact us; we offer customized liquid cooling services.
| Place of Origin: | Huizhou, China | Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100 | Shape: | Square |
| Applications: | Heat dissipation for chips in servers, data centers, high-end computers, etc. | Certifications: | ISO 9001:2015, ISO 14001:2015 |
| Surface Treatment: | Cleaning, Anti-Oxidation | Quality Control: | 100% Thermal Testing |
| Additional Processes: | CNC Machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
