This server liquid cooling assembly consists of two aluminum cold plates, one copper cold plate, and stainless steel tubing, which are joined via a vacuum brazing process to ensure seamless connections between the cold plates and tubing, forming an open-loop liquid cooling circuit. The cold plates are directly bonded to the chips to enhance heat dissipation efficiency. Strict quality control is achieved through precise control of the brazing process, ensuring the entire assembly is leak-free and the system is more reliable. The flat, smooth surfaces of the liquid-cooled plates allow for a tight fit with the chips, resulting in higher thermal conductivity for the entire assembly and improved heat dissipation efficiency.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100/Aluminum AL 3003 | Shape: | Square |
| Applications: | Servers, data centers, high-end computers, etc. | Vacuum Brazing Tensile Strength: | 80–92 N/mm² |
| Surface Treatment: | Cleaned, anti-oxidation | Quality Control: | 100% thermal testing |
| Additional processes: | CNC machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.