The LGA4677 Data Center Direct-to-Chip Liquid Cooling Plate is a high-performance cooling solution designed specifically for Intel Xeon processors. The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This CPU vacuum-brazed microchannel liquid cooling plate features an advanced, precision microchannel design that significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation.
| Server Form Factor | 1U Server | CPU TDP | 400W |
| CPU Socket Type | LGA 4677 | Lifespan | 50,000 hours |
| Liquid Cooling Plate Dimensions | 118 × 78 × 19.1 mm | Liquid Cooling | 1U Liquid Cooling |
| Weight | 420 grams | Liquid Cooler Material | Copper base + copper fins |
| Fin thickness | 0.15 mm | Cooling Type | Liquid Cooling |
| Fin Spacing | 0.15 mm | RoHS Compliance | Compliant |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.