The SP5 Server CPU Liquid Cooling Plate is a high-performance cooling solution designed specifically for AMD EPYC series processors. The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This SP5-socket liquid cooling plate features an advanced, precision microchannel design and is manufactured using a vacuum brazing process. This significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation while ensuring the cooling plate is leak-free, thereby providing a safe and stable operating environment for data centers.
| Server Form Factor | 1U Server | CPU TDP | 500 watts |
| CPU Socket Type | SP5 Socket (LGA6096 Socket) | Lifespan | 50,000 hours |
| Liquid Cooler Dimensions | 118 mm × 78.9 mm × 25 mm | Liquid Cooling | 1U Liquid Cooling |
| RoHS Compliance | Compliant | Liquid Cooler Material | Copper base + copper fins |
| Fin Thickness | 0.15 mm | Cooling Type | Liquid cooling |
| Fin spacing | 0.15 mm | CPU Support | AMD EPYC 9004 Series (AMD EPYC™ 9684X, etc.) |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
