1. Copper base with high thermal conductivity
2. Optimized E-shaped microchannel design that increases the product’s thermal contact area, improves thermal circulation efficiency, and delivers superior cooling performance
3. Through design and manufacturing processes, the drive pump is enclosed in a reinforced PPS chamber, effectively reducing vibration and noise
4. Three-phase brushless motor
5. Extremely low water absorption rate
6. Flexible and supple FEP tubing for easy installation
7. Ultra-quiet water pump that provides a quiet environment while delivering efficient cooling
8. Long service life and easy maintenance
9. Supports LGA 1700 socket platforms
| Compatible Models | LGA 1700 | CPU TDP | 360 W |
| CPU Socket Type | LGA 1700 | Lifespan | 50,000 hours |
| Server Form Factor | 2U Server | Product Name | Liquid-Cooled Heatsink |
| Water-cooling unit dimensions | 391 mm × 45 mm × 77 mm | Applications | 2U Liquid Cooling |
| Water Pump Dimensions | 118 mm × 92.4 mm × 39.5 mm | Liquid Cooler Material | Water fin array + copper base |
| Fin Thickness | 0.15 mm | Cooling Type | Liquid cooling |
| Fin spacing | 0.15 mm | RoHS Standard | Compliant |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
