This is a high-efficiency cooling solution designed specifically for the NVIDIA GB200, ensuring that the superchip maintains optimal performance and exceptional energy efficiency even under extreme operating conditions.
Key Features:
High-Efficiency Thermal Design: Features a high-density finned microchannel design that significantly increases the heat dissipation surface area, enabling rapid and uniform heat dissipation for exceptional cooling performance.
Easy Installation and Maintenance: The unique floating copper tube design supports adaptive fine-tuning, enabling quick, hassle-free assembly and improved serviceability.
Integrated Structure: Key components are fully welded, eliminating the risk of leaks and ensuring a robust structure that maintains high reliability during prolonged heavy-load operation.
High-Thermal-Conductivity Materials: The primary contact surface uses high-thermal-conductivity pure copper (Cu1100) to ensure smooth and efficient heat transfer from the chip surface to the coolant.
These liquid cooling plate circuits serve as critical infrastructure supporting the computational density and performance requirements of the GB200, providing stable and reliable thermal management for data centers and AI clusters.
| Place of Origin: | Huizhou, China | Certifications: | ISO 9001:2008, ISO 14001:2004 |
| Materials: | Cu1100, SUS304 | Process: | Vacuum brazing |
| Other processes: | CNC Machining | Applications: | AI Server Liquid Cooling Systems |
| Surface Treatment: | Cleaning | Quality Control: | 100% Thermal Testing |
| Dimensions: | Customization | OEM: | Yes |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
