The copper liquid cooling assembly for the direct liquid cooling loop of the server CPU copper-brazed liquid cooling plate consists of four copper CPU liquid cooling plates and copper tubing. These components are joined via a vacuum brazing process to ensure seamless connections between the cooling plates and tubing, forming an open-loop server liquid cooling circuit. The direct contact between the cooling plate and the chip enhances heat dissipation efficiency. Strict quality control is achieved through precise control of the brazing process, ensuring the entire assembly is free from the risk of leaks and enhancing the system’s reliability. The flat, smooth surface of the cold plate allows for a tight fit against the chip, resulting in higher thermal conductivity for the entire assembly and improved heat dissipation efficiency.
| Process: | Vacuum Brazing Process | Hardness: | T3-T8 |
| Material: | Copper C1100/C1220 | Shape: | Square |
| Applications: | Heat dissipation for chips in servers, data centers, high-end computers, etc. | Certifications: | ISO 9001:2015, ISO 14001:2015 |
| Surface Treatment: | Anti-oxidation | Quality Control: | 100% Thermal Testing |
| Additional Processes: | CNC Machining | Dimensions: | Customizable |
| Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.