Mini Water-Cooling Head for Vacuum Brazing AI Liquid-Cooled Server Chips

This water block is made of aluminum or copper, which offers high thermal conductivity and quickly dissipates heat generated by server chips (such as GPUs and CPUs). The micro-channel design enables the compact unit to deliver higher thermal efficiency within space-constrained servers. Vacuum brazing technology is used to join components such as the cold plate and connectors within the water block, ensuring that liquid cooling systems in data centers or liquid-cooled servers are free from the risk of leaks.

Additional information

Product Description:

Place of Origin: Huizhou, China Original Heat Sink Manufacturer: Yes
Process: Vacuum brazing process Hardness: T3-T8
Material: Aluminum or Copper Shape: Square
Applications: Heat dissipation for chips in servers, data centers, high-end computers, etc. Vacuum brazing tensile strength: 340–390 N/mm²
Surface Treatment: Oxidation-resistant Quality Control: 100% thermal testing
Additional Processes: CNC Machining Dimensions: Customizable

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.