1. Copper base with high thermal conductivity
2. Optimized E-shaped microchannel design that improves thermal circulation efficiency and increases the product’s thermal contact area, delivering superior cooling performance
3. The drive pump is encased in a reinforced PPS chamber through specialized design and manufacturing processes, effectively reducing vibration and noise
4. Three-phase silent motor
5. Extremely low water absorption
6. Flexible FEP tubing for easy installation
7. Very quiet water pump
8. Long service life
9. Supports LGA 115X socket platforms
| Compatible Models | LGA115X | CPU TDP | 350W |
| CPU Socket Type | LGA 115X | Lifespan | 50,000 hours |
| Server Form Factor | 1U Server | Product Name | LGA 1151 Liquid Cooler Heatsink |
| Liquid Cooler Dimensions | 350 × 200 × 40 mm | Applications | 1U Server Liquid Cooling |
| Weight | 400 grams | Liquid Cooler Material | Water block + copper base |
| Fin thickness | 0.15 mm | Cooling Type | Liquid Cooling |
| Fin Spacing | 0.15 mm | RoHS Compliance | Compliant |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
