Liquid-Cooled Server LGA4677 Socket Liquid-Cooling Plate

The LGA4677 Direct-Contact CPU Liquid Cooling Plate is a high-performance cooling solution designed specifically for Intel Xeon Scalable processors (Platinum Series). The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This CPU microchannel liquid cooling plate features an advanced, precision microchannel design that significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation.​​​

Additional information

Product Description:

Compatible ModelsLGA 4677CPU TDP400W
CPU Socket TypeLGA 4677 SocketRoHS ComplianceCompliance
Server Form Factor1U ServerProduct NameLGA 4677 Water Block
Liquid Cooler Dimensions118mm × 78mm × 25mmLiquid Cooling1U Liquid Cooling
Fin Thickness0.15 mmLiquid Cooler MaterialCopper base + copper fins
Fin spacing0.15 mmCooling TypeLiquid Cooling
CPU SupportIntel Xeon Platinum processors (Intel Xeon Platinum 8470 processor, etc.)

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.