Liquid-Cooled Server LGA4677 Socket Liquid-Cooling Plate

The LGA4677 Direct-Contact CPU Liquid Cooling Plate is a high-performance cooling solution designed specifically for Intel Xeon Scalable processors (Platinum Series). The cooling plate’s surface makes direct, tight contact with the CPU die, ensuring the shortest possible heat transfer path. It is designed to unlock the full potential of top-tier processors and safeguard your mission-critical and high-performance computing workloads. This CPU microchannel liquid cooling plate features an advanced, precision microchannel design that significantly increases the contact area between the coolant and the heat source, enabling rapid dissipation of the immense heat generated during CPU operation.​​​

Additional information

Product Description:

Compatible Models LGA 4677 CPU TDP 400W
CPU Socket Type LGA 4677 Socket RoHS Compliance Compliance
Server Form Factor 1U Server Product Name LGA 4677 Water Block
Liquid Cooler Dimensions 118mm × 78mm × 25mm Liquid Cooling 1U Liquid Cooling
Fin Thickness 0.15 mm Liquid Cooler Material Copper base + copper fins
Fin spacing 0.15 mm Cooling Type Liquid Cooling
CPU Support Intel Xeon Platinum processors (Intel Xeon Platinum 8470 processor, etc.)

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.