This direct-contact liquid cooling plate is an ultimate cooling solution designed specifically for Intel’s high-end LGA 9324 platforms. With a cooling capacity of 550W TDP, it is particularly well-suited for Intel Xeon server processors. It reduces the risk of thermal throttling in server systems and significantly extends the service life of the hardware.
Key Advantages:
1. With 550W of ultimate cooling performance, it effortlessly handles demanding thermal requirements such as overclocking, 3D rendering, and AI computing.
2. The micro-channel design features a dense fin structure, increasing the cooling surface area by 30% and improving thermal conductivity by 40%.
3. Compatible with the LGA9324 socket; the full-coverage copper base is perfectly matched with the latest generation of Intel Xeon server processors.
4. Compact design compatible with mainstream cases and all-in-one liquid cooling systems.
5. Aerospace-grade durable materials with a nickel-plated, corrosion-resistant copper base.
| Place of Origin | Huizhou, China | CPU TDP | 550W |
| CPU Socket Type | LGA 9324 Socket | Service Life | 50,000 hours |
| Server Form Factor | 1U Server | Product Name | LGA 9324 Liquid Cooling Plate |
| Liquid Cooling Plate Dimensions | 156 mm × 107.5 mm × 26 mm | Liquid Cooling | 1U Liquid Cooling |
| RoHS Standard | Compliance | Liquid Cooler Materials | Copper base + copper fins |
| Fin thickness | 0.15 mm | Cooling Type | Liquid Cooling |
| Fin Spacing | 0.15 mm | CPU Support | Intel Xeon Diamond Rapids Processor |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
