The memory module liquid cooling plate is made of copper and stainless steel, offering high thermal conductivity to rapidly dissipate heat generated by server DIMM memory modules. The liquid cooling plate is welded using vacuum brazing technology to ensure there is no risk of fluid leakage in the liquid cooling systems of data centers or liquid-cooled servers. This memory module cold plate is designed for liquid cooling of DIMM memory modules. It is connected in series with the CPU cold plate to dissipate heat from the memory modules via thermal conduction. Xinda Technology provides components such as CPU/GPU liquid cooling plates, memory module liquid cooling plates, and cold plate connectors, as well as complete liquid cooling systems for liquid-cooled servers and data centers. As a provider and manufacturer of liquid cooling solutions, we possess advanced liquid cooling technology and professional brazing expertise. If you are looking for liquid cooling system components or advanced data center liquid cooling solutions, please contact us. We offer customized liquid cooling services.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper and aluminum | Shape: | Square |
| Applications: | Heat dissipation for chips in servers, data centers, high-end computers, etc. | Certifications: | ISO 9001:2015, ISO 14001:2015 |
| Surface Treatment: | Cleaning, Anti-Oxidation | Quality Control: | 100% thermal testing |
| Additional processes: | CNC machining | Dimensions: | Customizable |
| Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
