This product is a four-channel, zoned, closed-loop, all-in-one liquid-cooled copper heat sink module. It is a high-density integrated cooling solution custom-designed by Xinda Technology for AI multi-chip clusters, high-power IGBT arrays, high-voltage energy storage packs, and automotive domain control modules, effectively addressing the challenges of centralized layout of multiple heat sources and long-term stable cooling for high-power applications.
1. High-Purity, One-Piece, Integrally Molded Red Copper Base Material
CNC-machined from a single block of high-precision red copper and vacuum brazed for a sealed construction, this design features an ultra-high thermal conductivity coefficient and a zoned, independent flow channel design. It enables simultaneous and balanced heat dissipation across multiple chips and power devices, completely eliminating localized hotspots within the module and ensuring exceptional temperature control consistency.
2. Dual-Circuit Symmetrical Parallel Water-Cooling Architecture
Independent upper and lower loops of bent red copper tubing with a symmetrical flow-splitting design ensure uniform distribution of inlet and outlet fluid flow. Multiple heat sources operate without interfering with one another, significantly enhancing overall cooling redundancy and minimizing temperature fluctuations even under high-power, full-load conditions.
3. External Stainless Steel Flexible Bellows Tubing
Equipped with 304 stainless steel anti-kink metal bellows tubing that resists high- and low-temperature fatigue, vibration, and tensile stress, as well as aging and corrosion. It adapts to complex cabinet routing and enables long-distance connections to cooling sources, ensuring no leaks or cracks even under long-term hot-and-cold cycling conditions.
4. Standardized Anti-Vibration Locking Mounting Structure
Fully secured with screws at every mounting point, designed for industrial control and automotive applications with severe vibration, ensuring vibration resistance and preventing loosening; custom-shaped design that matches the customer’s PCB and module installation space 1:1, enabling a compact, embedded installation that does not occupy additional cabinet space.
5. Exceptional Sealing, Safety, and Reliability
The entire chamber undergoes 100% high-pressure airtightness testing, pressure burst testing, and high-low temperature cyclic aging tests. Compatible with ethylene glycol coolant, it resists acids and alkalis and prevents scaling, ensuring no risk of fluid leakage during 7×24-hour uninterrupted high-load operation.
Cooling for multi-GPU computing clusters in AI servers; cooling for domain controllers in new energy vehicles; cooling for multiple IGBT power modules in energy storage PCS; cooling for high-power arrays in photovoltaic inverters; cooling for high-power, high-frequency industrial control equipment
Supports fully customized design for flow channel topology, external dimensions, connector specifications, tubing length, and mounting hole positions; offers rapid prototyping and stable mass production delivery; provides full-cycle collaboration with customers for structural integration and operational condition validation.
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
