Precision Semiconductor Components

Precision Semiconductor Components

Precision Semiconductor Components: From Monocrystalline Silicon to Vacuum Chambers—Defining the “Skeleton and Blood Vessels” of Process Equipment

Focusing on etching, thin-film deposition, lithography, and metrology equipment, we provide machining services for core components that meet SEMI standards, featuring high cleanliness, corrosion resistance, and ultra-low outgassing.

Your one-stop precision manufacturing partner for original equipment manufacturers (OEMs) and domestic alternatives

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Additional information

Machining Category

CNC Machining
Materials

Any Material
Machining Dimensions

Any Size
Machining Accuracy

±0.005mm

Product Description:

Core Processing Technologies

Ultra-High Vacuum & Cleanliness Control

  • Class 10 (with Class 1,000 in certain stages) and localized Class 100 clean assembly environment, with strict control over particulates and metal ion precipitation.
  • Core component surface roughness Ra ≤ 0.1μm, combined with precision electropolishing/passivation treatment, meeting ultra-high vacuum (UHV) leak rate requirements of 10⁻⁹ Pa·m³/s, eliminating background contamination.

Precision Forming of Materials

  • Difficult-to-machine metals: Non-magnetic stainless steel (316L/304L), aluminum alloys 6061/7075, Hastelloy C-22, Invar alloy (low thermal expansion).
  • Precision ceramics/quartz: Alumina (Al₂O₃), Aluminum Nitride (AlN), high-purity quartz (fused silica), maintaining dielectric strength and thermal stability after processing.
  • Engineering plastics: PEEK, PTFE, Vespel, PCTFE, PFA, meeting plasma corrosion resistance and low outgassing requirements.

Hybrid Processes & Quality Traceability

  • Integrated 5-axis CNC, precision grinding, EDM (electrical discharge machining), laser micromachining, and precision welding (electron beam/laser welding).
  • Full-process SEMI-standard control: from ingot/plate material certifications → in-process SPC → final cleaning and packaging (double-layer vacuum bags + nitrogen protection), with batch numbers fully traceable.

Component Processing Capabilities

Equipment Type Typical Parts Key Requirements
Etch Equipment Upper/lower electrode plates, gas distribution plates (GSP), focus rings Resistance to fluorine/chlorine-based plasma corrosion, precision micro-hole machining (hole diameter 0.3mm).
Thin-Film Deposition (PVD/CVD) Chamber liners, heater plates, shields, target back plates High flatness (0.01mm/m), dimensional stability under high-temperature thermal cycling.
Lithography Equipment Wafer chucks, precision motion guide rails Ultra-high flatness (micron-level), non-magnetic/low thermal expansion materials.
Inspection/Sorting Equipment Probe card bases, precision fixtures No dynamic resistance, long-term wear resistance.

Processing Precision

Parameter Capability
Linear Dimension Tolerance ±0.005mm
Positional Accuracy / Coaxiality ≤0.008mm
Surface Roughness Ra ≤ 0.1μm (metals), Ra ≤ 0.4μm (ceramics/quartz)
Flatness / Parallelism ≤0.005mm/100mm
Micro-Hole Machining Minimum hole diameter 0.1mm, depth-to-diameter ratio up to 20:1

Why Choose Us

Reverse Engineering & Optimization Capabilities

  • Equipped with high-precision CMM and blue light scanners, enabling accurate measurement and mapping of imported components.
  • While maintaining interface dimensions unchanged, optimize thread parameters, seal groove structures, and material grades to extend component service life in harsh process chambers.

Rapid Response & Delivery

  • Simple parts delivered within 48 hours, complex parts within 5 working days.
  • Supports orders starting from one piece: prototype validation, small-batch trial production, to high-volume stable supply (monthly capacity up to 5,000+ parts).

Cleanroom Packaging & On-Site Support

  • Standardized process prior to packaging: ultrasonic cleaning + deionized water rinsing + oven drying in clean environment.
  • Double-layer vacuum-sealed aluminum foil bags with humidity indicator cards and particle count test reports, meeting ready-to-use requirements upon unboxing.

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