This data center liquid-cooling plate assembly is made of copper, which offers high thermal conductivity and can quickly dissipate the heat generated by server CPUs. Vacuum brazing technology is used to join the water-cooling plate, pipes, and fittings, ensuring that the liquid-cooling system in data centers or liquid-cooled servers is free from the risk of leaks.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100/C1220 | Shape: | Square |
| Applications: | Heat dissipation for chips in servers, data centers, high-end computers, etc. | Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
| Surface Treatment: | Cleaning, Anti-Oxidation | Quality Control: | 100% Thermal Testing |
| Additional Processes: | CNC machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
