This water block is made of copper, which offers high thermal conductivity and can quickly dissipate the heat generated by server chips (such as GPUs and CPUs). The cold plate, connectors, and other components within the water block are joined using vacuum brazing technology, ensuring that the liquid cooling system in data centers or liquid-cooled servers is free from the risk of leaks.
| Process: | Continuous Furnace Vacuum Brazing Process | Hardness: | T3-T8 |
| Material: | Copper C1100 | Shape: | Square |
| Applications: | Heat dissipation for chips in servers, data centers, high-end computers, etc. | Certifications: | ISO 9001:2015, ISO 14001:2015 |
| Surface Treatment: | Cleaning, Anti-Oxidation | Quality Control: | 100% thermal testing |
| Additional processes: | CNC machining | Dimensions: | Customizable |
| Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
