Custom Server Direct-to-Chip Liquid Cooling CPU Cold Plate Circuit

This server liquid-cooling assembly consists of multiple cold plates, pipes, and other components that are joined together via a vacuum brazing process to ensure seamless connections between the cold plates, pipes, and other components, forming an open-loop liquid-cooling circuit. The liquid cooling plates are directly bonded to the chips to enhance heat dissipation efficiency. Strict quality control is achieved through precise control of the brazing process, ensuring the entire assembly is leak-free and the system is more reliable. The flat, smooth surface of the cooling plates allows for a tight bond with the chips, resulting in higher thermal conductivity for the entire assembly and improved heat dissipation efficiency. A tensile strength of 340–390 N/mm² ensures excellent durability and structural stability for the entire server system under high-pressure conditions.