This copper liquid-cooling assembly consists of four copper CPU cold plates and copper tubing, which are joined via a vacuum brazing process to ensure a seamless connection between the cold plates and tubing, forming an open-loop liquid-cooling circuit. The cold plates are directly bonded to the chip to enhance heat dissipation efficiency. Strict quality control is achieved through precise control of the brazing process, ensuring the entire assembly is leak-free and the system is more reliable. The flat, smooth surface of the cold plates allows for a tight fit against the chip, resulting in higher thermal conductivity for the entire assembly and improved heat dissipation efficiency.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100/C1220 | Shape: | Square |
| Applications: | Servers, data centers, high-end computers, etc. | Tolerance: | 0.05 mm |
| Surface Treatment: | Cleaned, Anti-Oxidation | Quality Control: | 100% Full Inspection |
| Additional Processes: | CNC machining | Dimensions: | Customizable |
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