This server liquid cooling assembly consists of two copper CPU cold plates, stainless steel tubing, and a water block, which are joined via a vacuum brazing process to ensure seamless connections between the cold plates, tubing, and water block, forming an open-loop liquid cooling circuit. The cold plates are directly bonded to the chips to enhance heat dissipation efficiency. Strict quality control is achieved through precise control of the brazing process, ensuring the entire assembly is leak-free and the system is more reliable. The flat, smooth surface of the cold plates allows for a tight fit with the chips, resulting in higher thermal conductivity for the entire assembly and improved heat dissipation efficiency. A tensile strength of 340–390 N/mm² ensures excellent durability and structural stability for the entire server system under high-pressure conditions.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100/Stainless Steel SUS 304 | Shape: | Square |
| Applications: | Servers, data centers, high-end computers, etc. | Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
| Surface Treatment: | Cleaned, anti-oxidation | Quality Control: | 100% thermal testing |
| Additional processes: | CNC machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.