This server manifold is made of high-purity copper and can be manually connected and installed. It can be flexibly arranged vertically or horizontally within the rack, providing an interface between cold plate-based liquid-cooled servers and the CDU. This ensures that the server liquid-cooling circuit system can reliably and efficiently dissipate heat from the server’s critical chips (CPUs, GPUs, etc.) under prolonged high loads and frequent temperature fluctuations, thereby guaranteeing stable equipment operation. The high-precision vacuum brazing process ensures that every joint in the server rack manifold is free of porosity and cracks, eliminating the risk of fluid leakage.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper C1100/C1220 | Shape: | Square |
| Applications: | Servers, data centers, high-end computers, etc. | Vacuum Brazing Tensile Strength: | 340–390 N/mm² |
| Surface Treatment: | Cleaned, anti-oxidation | Quality Control: | 100% thermal testing |
| Additional Processes: | CNC machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.