Liquid-Cooled Microchannel Plate for AI Server Direct-Attach CPUs

This AI server CPU liquid cooling plate is made of copper, which offers high thermal conductivity and can quickly dissipate the heat generated by the server CPU chip. The surface is nickel-plated, giving the liquid cooling plate corrosion resistance and wear resistance. The direct-contact liquid cooling plate utilizes vacuum brazing technology and features a microchannel design, ensuring high-performance heat dissipation while eliminating the risk of fluid leaks in liquid cooling systems within data centers or liquid-cooled servers.

Additional information

Product Description:

Place of Origin:Huizhou, ChinaOriginal Heat Sink Manufacturer:Yes
Process:Vacuum brazing processHardness:T3-T8
Material:CopperShape:Square
Applications:Servers, data centers, high-end computers, etc.Tolerance:0.05 mm
Surface Treatment:Nickel PlatingQuality Control:100% Full Inspection
Additional Processes:CNC MachiningDimensions:Customizable

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We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.