This direct-contact CPU liquid cooling plate is made of copper, which offers high thermal conductivity and can rapidly dissipate heat generated by server chips (such as GPUs and CPUs). The AI server liquid cooling plate utilizes vacuum brazing technology and features a microchannel design, ensuring high-performance heat dissipation while eliminating the risk of fluid leaks in liquid cooling systems within data centers or liquid-cooled servers.
| Place of Origin: | Huizhou, China | Original Heat Sink Manufacturer: | Yes |
| Process: | Vacuum brazing process | Hardness: | T3-T8 |
| Material: | Copper | Shape: | Square |
| Applications: | Servers, data centers, high-end computers, etc. | Tolerance: | 0.05 mm |
| Surface Treatment: | Polished | Quality Control: | 100% Full Inspection |
| Additional Processes: | CNC Machining | Dimensions: | Customizable |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
