This liquid cooling circuit is a high-performance liquid cooling solution specifically designed for NVIDIA H100 Tensor Core GPU servers. Through meticulous engineering and manufacturing processes, it ensures that the H100 GPUs can operate stably and continuously under high-intensity computational workloads, unleashing their maximum computational power.
Key Advantages:
High-Efficiency Thermal Design: Utilizes high-density serrated microchannels and high-thermal-conductivity copper (Cu1100) to achieve optimal heat transfer efficiency and rapidly dissipate heat from the core.
Easy Integration and Installation: The integrated modular design is fully compatible with H100 hardware, significantly simplifying the assembly process and improving the efficiency of deployment and maintenance.
Exceptional Operational Reliability: Critical components are manufactured using integrated molding and welding technologies to ensure a robust structure. This approach eliminates the risk of leaks from the outset, guaranteeing the extremely high reliability required for long-term data center operation.
This custom liquid-cooling loop is the ideal cooling solution for building high-density, eco-friendly, and highly efficient H100 computing clusters.
| Material: | Cu1100, SUS304 | Process: | Vacuum brazing |
| Other processes: | CNC Machining | Applications: | AI Server Liquid Cooling Systems |
| Surface Treatment: | Cleaning | Quality Control: | 100% Thermal Testing |
| Dimensions: | Customization | OEM: | Yes |
| Place of Origin: | Huizhou, China |
We provide thermal management solutions for industries such as AI computing, data centers, and renewable energy. If you have any questions, would like a quote, or are interested in technical collaboration, please contact us.
