Detailed Explanation of the Structure and Advantages of the Two Products
1. Dual Heat Pipe with Bent Inlet/Outlet and Purple Copper Cold Plate (Top Model)
- Forged from a single piece of purple copper substrate, with built-in precision microcirculation microchannels. Maximizes thermal conductivity to rapidly and evenly dissipate concentrated high heat from the chip, preventing localized hot spots
- Dual-channel bent tubes are integrally formed using a seamless brazing sealing process, offering resistance to pressure and thermal shock. It ensures long-term zero leakage and no scaling under high- and low-temperature cycling conditions
- The surface precisely aligns with the heat-generating surface of the chip. With a standardized design for mounting holes, it supports in-situ installation on CPU/GPU computing chips and high-power IGBT modules
- External quick-connect fittings enable convenient tubing connections, making it suitable for distributed and long-distance liquid cooling circuits in server racks
2. Side-Mounted Straight-Through Port Square Purple Copper Water-Cooling Heatsink (Bottom Model)
- Precision CNC-machined from a single block of purple copper; sealed, pressure-equalizing channels provide comprehensive heat dissipation across the entire surface, offering a larger heat exchange area and superior temperature uniformity
- Dual side-mounted straight-through inlet and outlet ports enable a more compact tubing layout, making it perfectly suited for confined enclosures and sealed installation spaces in automotive electronic control units
- Standardized mounting holes at all four corners provide vibration resistance and prevent loosening, making it suitable for harsh operating conditions such as automotive vibrations and high-frequency industrial vibrations
- The entire chamber undergoes high-pressure airtight testing, ensuring insulation, dielectric strength, corrosion resistance, and aging resistance; fully compatible with energy storage packs, automotive BMS, and photovoltaic inverter applications
Core Technology Highlights of Xinda Technology
- All-copper, high-thermal-conductivity base material: Far surpasses the thermal conductivity of aluminum cooling plates, doubling heat dissipation efficiency in high-power, high-heat-flux-density scenarios
- High-precision sealing process: Enhanced by a dual-process approach combining vacuum brazing and friction welding; 100% factory testing for airtightness, withstand voltage, and burst pressure ensures long-term operation without risk of fluid leakage
- Full customization capabilities: Flow channel layout, external dimensions, connector specifications, hole spacing, and piping routes can all be customized to meet specific needs, ensuring a 1:1 match with the customer’s component structure
- Long-Term Stability Under Harsh Conditions: Resistant to high-low temperature cycling, acid and alkali coolants, and vibration-induced aging; suitable for 24/7 uninterrupted operation in automotive, outdoor energy storage, and data center applications
- Rapid Prototyping + Stable Mass Production: Xinda’s in-house precision machining production lines enable short-cycle prototyping and large-volume delivery with consistent quality and controllable lead times
Mainstream Application Scenarios
Heat dissipation for AI server computing chips, IGBTs in new energy vehicle electronic control units, PCSs in energy storage systems, high-power laser equipment, industrial high-frequency power modules, and high-heat components in photovoltaic inverters
